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Grinding & Dicing Services Incorporated
925 Berryessa Road
San Jose, CA 95133 USA
phone: 1-408-961-3720

Based in Silicon Valley, GDSI has 25+ years of wafer dicing experience, supporting both development and production-mode programs. Currently offering non-contact dicing services using stealth dicing technology for a pristine surface finish. Same day services if necessary for stealth support. Mechanical saw available for more resilient surface structures. Turnkey process flow including wafer thinning, dicing, automated pick and inspection. ISO 9001:2015 and ITAR registered. Free consultation on mask layout to ensure that your wafer is compatible with stealth design rules. GDSI collaborates with MEMS, semiconductor, and sensor foundries with an emphasis on yield improvement and design for manufacturability using stealth.

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